爱赛克底部填充胶39-ICH08_UNDERFILL
爱赛克底部填充胶39-ICH08_use for low temperature solder product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.






39-ICH08_爱赛克底部填充胶特长：
Liquid state
Property    Typical Value   Test Condition
Chemical    Epoxy (Black)
Specific Gravity                @25度
Thixotropic index             12s-1/120s-1
Viscosity     mPa·s        Cone plate type, 120s-1


Cured state
Property      Typical Value   Test Condition
Tensile Modulus         Gpa               25度, DMA
Tg                 120度                 DMS
CTE α1/α2         39/105  ppm/度         TMA
Tensile shear strength 16 Mpa               JIS K 6850
Volume resistivity x 1015Ω·cm     JIS K 6911
Surface resistivity x 1015Ω       JIS K 6911




爱赛克UNDERFILL底部填充胶39-ICH08相关产品：
衡鹏供应
爱赛克UNDERFILL底部填充胶39-ICH09